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Material Safety Data Sheets
DateDescriptionType 
08.09.07 
RBC-4200 Resin MSDS
RBC-4200 is a fire retardant version of the highly filled RBC-4100 thermall conductive epoxy. It is designed for applications where thermal conductivity, excellent electrical insulation, high heat distortion and low shrinkage are required.
Electronics MSDSDownload File
08.09.07 
RBC-4210 Resin MSDS
RBC-4200 is a thixotropic, fire retardant version of the highly filled RBC-4100 thermall conductive epoxy. It is designed for applications where thermal conductivity, excellent electrical insulation, high heat distortion and low shrinkage are required.
Electronics MSDSDownload File
08.09.07 
RBC-4100 Resin MSDS
RBC-4100 is a highly filled, thermally conductive epoxy resin designed for applications requiring excellent electrical insulation, high heat dissipation, and low shrinkage. It can be used as heat sink for large castings or for heat generating components.
Electronics MSDSDownload File
08.09.07 
AB-106 Hardener
RBC Industries AB-106 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
B-710, B-711 Hardener MSDS
RBC Industries B-710, B-711 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
B-320 Hardener MSDS
RBC Industries B-320 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
A-115 Hardener MSDS
RBC Industries A-115 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
A-122 Hardener MSDS
RBC Industries A-122 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
A-121 Hardener MSDS
RBC Industries A-121 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
A-96 Hardener MSDS
RBC Industries A-96 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
A-94 Hardener MSDS
RBC Industries A-94 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.09.07 
A-95 Hardener MSDS
RBC Industries A-95 Epoxy Hardener Material Safety Data Sheet.
Hardener MSDSDownload File
08.05.07 
RBC-3800 Hardener MSDS
RBC-3800 epoxy system is an unfilled, low viscosity, semi-flexible system used for epoxy potting and encapsulating or insulating electronic components. It exhibits excellent impact and thermal shock resistance and its electrical are stable at high temps.
Hardener MSDSDownload File
08.05.07 
RBC-3910 Hardener MSDS
RBC-3910 epoxy system is a filled version of the RBC-3900 that offers higher thermal conductivity and improved electrical properties. It is relatively low in viscosity and its mix ratio of 1:1 adds to its convieniant handling properties.
Hardener MSDSDownload File
08.05.07 
RBC-3900 Hardener MSDS
RBC-3900 is a low viscostiy epoxy system designed for potting and encapsulating electrical and electronic components. It offers excellent moisture resistance, convenient mix ratio, very low viscosity and excellent thermal shock characteristics.
Hardener MSDSDownload File
08.05.07 
RBC-3810 Hardener MSDS
RBC-3810 epoxy system is a filled, medium viscosity, semi-flexible version of epoxy resin RBC-3800. It exhibits less shrinkage than the RBC-3800 and physical properties are better and thermal conductivity is increased.
Hardener MSDSDownload File
08.05.07 
RBC-3700 Hardener MSDS
RBC-3700 system is a semi-flexible, unfilled epoxy system, most often used in epoxy impregnating, epoxy potting and/or encapsulating. RBC-3700 offers excellent shock resistance, electrical properties and excellent handling properties.
Hardener MSDSDownload File
08.05.07 
RBC-3710 Hardener MSDS
RBC-3710 is a filled, high viscosity version of RBC-3700 which exhibits greater tensile and compressive strength. It offers a long pot life at elevated temperatures which insures good wettability and impregnation.
Hardener MSDSDownload File
08.05.07 
RBC-3910 Resin MSDS
RBC-3910 epoxy system is a filled version of the RBC-3900 that offers higher thermal conductivity and improved electrical properties. It is relatively low in viscosity and its mix ratio of 1:1 adds to its convieniant handling properties.
Electronics MSDSDownload File
08.05.07 
RBC-3900 Resin MSDS
RBC-3900 is a low viscostiy epoxy system designed for potting and encapsulating electrical and electronic components. It offers excellent moisture resistance, convenient mix ratio, very low viscosity and excellent thermal shock characteristics.
Electronics MSDSDownload File
08.05.07 
RBC-3810 Resin MSDS
RBC-3810 epoxy system is a filled, medium viscosity, semi-flexible version of epoxy resin RBC-3800. It exhibits less shrinkage than the RBC-3800 and physical properties are better and thermal conductivity is increased.
Electronics MSDSDownload File
08.05.07 
RBC-3800 Resin MSDS
RBC-3800 epoxy system is an unfilled, low viscosity, semi-flexible system used for epoxy potting and encapsulating or insulating electronic components. It exhibits excellent impact and thermal shock resistance and its electrical are stable at high temps.
Electronics MSDSDownload File
08.05.07 
RBC-3710 Resin MSDS
RBC-3710 is a filled, high viscosity version of RBC-3700 which exhibits greater tensile and compressive strength. It offers a long pot life at elevated temperatures which insures good wettability and impregnation.
Electronics MSDSDownload File
08.05.07 
RBC-3700 Resin MSDS
RBC-3700 System is a semi-flexible, unfilled epoxy system, most often used in epoxy impregnating, epoxy potting and/or encapsulating. RBC-3700 offers excellent shock resistance, electrical properties and excellent handling properties.
Electronics MSDSDownload File
08.02.07 
RBC-3600 Resin MSDS
RBC-3600 is a low-viscosity, low density, filled epoxy potting compound used where lightweight castings are necessary without the loss of acceptable physical and electrical properties. RBC-3600 possesses excellent air release and good flowability.
Electronics MSDSDownload File
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