RBC Industries

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Date	Description	Type
Material Safety Data Sheets
07.10.07	RBC-3400 Resin MSDS RBC-3400 is a general purpose epoxy potting compound and casting resin with physical and electrical properties similar to RBC-3300. However, RBC-3400 offers superior wetting characteristics when potting intricate components.	Electronics MSDS
07.19.07	RBC-3410 Resin MSDS RBC-3410 is a filled, low-viscosity, general purpose epoxy potting and casting resin. Its physical and electrical properties are similar to RBC-3300 Resin, but like RBC-3400 offers superior wetting characteristics when potting intricate components.	Electronics MSDS
08.02.07	RBC-3412 Resin MSDS RBC-3412 is a filled, thixotropic, general purpose dip coating epoxy resin. Its’ physical and electrical properties are similar to #3300 Resin, but #3412 is can be used for dipping and coating transformers, coils, capacitors, etc.	Electronics MSDS
07.19.07	RBC-3425 Resin MSDS RBC-3425 is a filled, low viscosity casting resin which can be used for duplicating any size casting when used with the appropriate hardener. Because these are 100% solids systems there is very little shrinkage.	Electronics MSDS
08.02.07	RBC-3428 Resin MSDS RBC-3428 is a filled, low viscosity, semi-flexible potting and encapsulating resin, which can be used for any size casting when used with the appropriate hardener. Plus, because these are 100% solids, VOC compliant systems there is very little shrinkage.	Electronics MSDS
08.02.07	RBC-3500 Resin MSDS RBC-3500 is a medium viscosity, filled epoxy casting resin offering low shrinkage and good machineability. With proper hardener selection, RBC-3500 can be used for very large as well as very small, intricate castings where good flowability and excellent a	Electronics MSDS
08.02.07	RBC-3600 Resin MSDS RBC-3600 is a low-viscosity, low density, filled epoxy potting compound used where lightweight castings are necessary without the loss of acceptable physical and electrical properties. RBC-3600 possesses excellent air release and good flowability.	Electronics MSDS
08.02.07	RBC-3610 Resin MSDS RBC-3610 is a thixotropic version of RBC-3600. Like the RBC-3600, it is especially useful in the aerospace and automotive industries where increased empahsis is placed on high performance from light weight components.	Electronics MSDS
08.05.07	RBC-3700 Hardener MSDS RBC-3700 system is a semi-flexible, unfilled epoxy system, most often used in epoxy impregnating, epoxy potting and/or encapsulating. RBC-3700 offers excellent shock resistance, electrical properties and excellent handling properties.	Hardener MSDS
08.05.07	RBC-3700 Resin MSDS RBC-3700 System is a semi-flexible, unfilled epoxy system, most often used in epoxy impregnating, epoxy potting and/or encapsulating. RBC-3700 offers excellent shock resistance, electrical properties and excellent handling properties.	Electronics MSDS
08.05.07	RBC-3710 Hardener MSDS RBC-3710 is a filled, high viscosity version of RBC-3700 which exhibits greater tensile and compressive strength. It offers a long pot life at elevated temperatures which insures good wettability and impregnation.	Hardener MSDS
08.05.07	RBC-3710 Resin MSDS RBC-3710 is a filled, high viscosity version of RBC-3700 which exhibits greater tensile and compressive strength. It offers a long pot life at elevated temperatures which insures good wettability and impregnation.	Electronics MSDS
08.05.07	RBC-3800 Hardener MSDS RBC-3800 epoxy system is an unfilled, low viscosity, semi-flexible system used for epoxy potting and encapsulating or insulating electronic components. It exhibits excellent impact and thermal shock resistance and its electrical are stable at high temps.	Hardener MSDS
08.05.07	RBC-3800 Resin MSDS RBC-3800 epoxy system is an unfilled, low viscosity, semi-flexible system used for epoxy potting and encapsulating or insulating electronic components. It exhibits excellent impact and thermal shock resistance and its electrical are stable at high temps.	Electronics MSDS
08.05.07	RBC-3810 Hardener MSDS RBC-3810 epoxy system is a filled, medium viscosity, semi-flexible version of epoxy resin RBC-3800. It exhibits less shrinkage than the RBC-3800 and physical properties are better and thermal conductivity is increased.	Hardener MSDS
08.05.07	RBC-3810 Resin MSDS RBC-3810 epoxy system is a filled, medium viscosity, semi-flexible version of epoxy resin RBC-3800. It exhibits less shrinkage than the RBC-3800 and physical properties are better and thermal conductivity is increased.	Electronics MSDS
08.05.07	RBC-3900 Hardener MSDS RBC-3900 is a low viscostiy epoxy system designed for potting and encapsulating electrical and electronic components. It offers excellent moisture resistance, convenient mix ratio, very low viscosity and excellent thermal shock characteristics.	Hardener MSDS
08.05.07	RBC-3900 Resin MSDS RBC-3900 is a low viscostiy epoxy system designed for potting and encapsulating electrical and electronic components. It offers excellent moisture resistance, convenient mix ratio, very low viscosity and excellent thermal shock characteristics.	Electronics MSDS
08.05.07	RBC-3910 Hardener MSDS RBC-3910 epoxy system is a filled version of the RBC-3900 that offers higher thermal conductivity and improved electrical properties. It is relatively low in viscosity and its mix ratio of 1:1 adds to its convieniant handling properties.	Hardener MSDS
08.05.07	RBC-3910 Resin MSDS RBC-3910 epoxy system is a filled version of the RBC-3900 that offers higher thermal conductivity and improved electrical properties. It is relatively low in viscosity and its mix ratio of 1:1 adds to its convieniant handling properties.	Electronics MSDS
08.09.07	RBC-4100 Resin MSDS RBC-4100 is a highly filled, thermally conductive epoxy resin designed for applications requiring excellent electrical insulation, high heat dissipation, and low shrinkage. It can be used as heat sink for large castings or for heat generating components.	Electronics MSDS
08.09.07	RBC-4200 Resin MSDS RBC-4200 is a fire retardant version of the highly filled RBC-4100 thermall conductive epoxy. It is designed for applications where thermal conductivity, excellent electrical insulation, high heat distortion and low shrinkage are required.	Electronics MSDS
08.09.07	RBC-4210 Resin MSDS RBC-4200 is a thixotropic, fire retardant version of the highly filled RBC-4100 thermall conductive epoxy. It is designed for applications where thermal conductivity, excellent electrical insulation, high heat distortion and low shrinkage are required.	Electronics MSDS

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